The porosity of gold plating by dust contamination

Electrical Contacts, 1988., Proceedings of the Thirty Fourth Meeting of the IEEE Holm Conference on Electrical Contacts Pub Date : 1900-01-01 DOI:10.1109/HOLM.1988.16132

Zhang Ji-gao, Zhou Ka-Da, Du Chang-Xiu

引用次数: 6

Abstract

The porosity of electric contacts caused by dust contamination during gold plating was much more serious than that caused by simply a roughness of the substrate. Nevertheless, experimental results showed that even when plating on a dusty substrate, porosity was still closely related to the substrate roughness. Dust contamination on rougher substrates produced larger numbers of pores. Pores caused during gold plating were inspected by both scanning electron microscopy and X-ray energy spectrometry. Silicon and aluminium, as well as other elements of dust particles found in the pores, showed the existence of dust contamination on the substrate. Various chemical and ultrasonic cleaning methods were tested in an attempt to improve the plating quality and to reduce pore formation at the contacts. It was found that ultrasonic cleaning in acetone for more than 20 minutes is necessary for reducing porosity and increasing the sliding duration.<>

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镀金孔隙度受粉尘污染

在镀金过程中，灰尘污染造成的电触点孔隙率比单纯的基材粗糙造成的孔隙率要严重得多。然而，实验结果表明，即使在有灰尘的基底上电镀，孔隙率仍然与基底粗糙度密切相关。较粗糙的基材上的灰尘污染会产生更多的孔隙。采用扫描电镜和x射线能谱法对镀金过程中产生的气孔进行了检测。硅和铝，以及在孔隙中发现的灰尘颗粒中的其他元素，表明衬底上存在灰尘污染。试验了各种化学和超声波清洗方法，试图提高镀层质量，减少接触处的孔隙形成。研究发现，在丙酮中进行20分钟以上的超声波清洗是减少孔隙率和延长滑动时间的必要条件。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Electrical Contacts, 1988., Proceedings of the Thirty Fourth Meeting of the IEEE Holm Conference on Electrical Contacts

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