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Failure Analysis Of Power Modules; A Look At The Packaging And Reliability Of Large IGBTs

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium Pub Date : 1900-01-01 DOI:10.1109/IEMT.1992.639922
H. de lambilly, H. Keser
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电源模块的故障分析大型igbt的封装和可靠性
本文章由计算机程序翻译，如有差异，请以英文原文为准。
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Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium
Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium
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