{"title":"Thermal modeling of through hole capacitors","authors":"J. Rajmond, P. Dan","doi":"10.1109/SIITME.2012.6384381","DOIUrl":null,"url":null,"abstract":"Through the course of this paper transient thermal conditions were investigated for through hole capacitor models built in SolidWorks. Firstly, the influences of the shape, casing material are determined, after which lifelike models for aluminum electrolytic, ceramic and plastic film capacitors are built and their efficiency regarding forced cooling and thermal power dissipation is investigated.","PeriodicalId":273985,"journal":{"name":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-12-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 18th International Symposium for Design and Technology in Electronic Packaging (SIITME)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SIITME.2012.6384381","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 8
Abstract
Through the course of this paper transient thermal conditions were investigated for through hole capacitor models built in SolidWorks. Firstly, the influences of the shape, casing material are determined, after which lifelike models for aluminum electrolytic, ceramic and plastic film capacitors are built and their efficiency regarding forced cooling and thermal power dissipation is investigated.