High performance socket characterization technique for microprocessors

Abstract

At present, most socket suppliers provide different specifications and measurement data based on their own "in-house" characterization set-up, which has resulted in a variety of different data reported. To provide a means for designers to correctly decide on a socket or vendor, a standard specification and standard characterization method are necessary. This standard specification will also correctly represent the physical and electrical behavior of the socket. In this paper, a new socket specification is given. To more accurately estimate the socket parasitics, a new 3D modeling method is proposed. A new measurement technique is defined for precisely extracting a socket's model component values. The measurement technique utilizes a de-embedding process and a unique test fixture to ensure the final parasitic values included only the parasitics of the socket. The difference between modeling and measured socket parasitics is within 10%. This technique has been demonstrated and adopted for all Intel socket suppliers.