Residual thermomechanical stresses in ultrathin chip stack technology

Abstract

The aim of this work is to analyze the thermo-mechanical stresses evolution produced during the fabrication sequence of the multi-level UTCS structure. Several non-linear material models have been taken into account during the process of modeling. We have therefore resorted to the Finite Element Method for the evaluation of such thermo- mechanical stresses that appears in the manufacturing and stacking process. These efforts are made to optimize the product and process design.