A Software Technique to Improve Yield of Processor Chips in Presence of Ultra-Leaky SRAM Cells Caused by Process Variation

M. Goudarzi, T. Ishihara, H. Yasuura
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引用次数: 8

Abstract

Exceptionally leaky transistors are increasingly more frequent in nano-scale technologies due to lower threshold voltage and its increased variation. Such leaky transistors may even change position with changes in the operating voltage and temperature, and hence, redundancy at circuit-level is not sufficient to tolerate such threats to yield. We show that in SRAM cells this leakage depends on the cell value and propose a first software-based runtime technique that suppresses such abnormal leakages by storing safe values in the corresponding cache lines before going to standby mode. Analysis shows the performance penalty is, in the worst case, linearly dependent to the number of so-cured cache lines while the energy saving linearly increases by the time spent in standby mode. Analysis and experimental results on commercial processors confirm that the technique is viable if the standby duration is more than a small fraction of a second.
工艺变化导致SRAM单元存在超泄漏时提高处理器芯片成品率的软件技术
由于阈值电压的降低及其变化的增加,在纳米技术中异常漏电晶体管越来越常见。这种漏电晶体管甚至可能随着工作电压和温度的变化而改变位置,因此,电路级的冗余不足以承受这种威胁。我们表明,在SRAM单元中,这种泄漏取决于单元值,并提出了第一种基于软件的运行时技术,该技术通过在进入待机模式之前将安全值存储在相应的缓存线路中来抑制这种异常泄漏。分析表明,在最坏的情况下,性能损失线性依赖于已修复的缓存线路的数量,而节能则随着待机模式的时间增加而线性增加。对商用处理器的分析和实验结果证实,如果待机时间超过一小部分秒,该技术是可行的。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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