Self-Heating Aware Threshold Voltage Modulation Conforming to Process and Ambient Temperature Variation for Reliable Nanosheet FET

Sunil Rathore, Rajeewa Kumar Jaisawal, P. Kondekar, N. Gandhi, Shashank Banchhor, Young Suh Song, N. Bagga
{"title":"Self-Heating Aware Threshold Voltage Modulation Conforming to Process and Ambient Temperature Variation for Reliable Nanosheet FET","authors":"Sunil Rathore, Rajeewa Kumar Jaisawal, P. Kondekar, N. Gandhi, Shashank Banchhor, Young Suh Song, N. Bagga","doi":"10.1109/IRPS48203.2023.10117918","DOIUrl":null,"url":null,"abstract":"Internal and external process variations severely affect the device threshold voltage $(\\mathrm{V}_{\\text{th}})$ and, in turn, the device's reliability. For the first time, this paper presented a thorough analysis of the self-heating aware $\\mathrm{V}_{\\text{th}}$ variation of a Nanosheet FET and, thus, the device's aging. Using well-calibrated TCAD models, we evaluated the 'change in $V_{th}\\ ^{\\prime}$ and performed an extensive design space exploration to analyze: (i) the impact of work function (WF) modulation owing to metal grain sizes and effective grains (for confined dimensions) on $\\mathrm{V}_{\\text{th}}$ variation; (ii) the impact of ambient temperature (TA) on $\\mathrm{V}_{\\text{th}}$ variation; (iii) the influence of trap charges on device characteristics; (iv) how the consideration of RDF impacted $\\mathrm{V}_{\\text{th}};$ (v) the device's aging, i.e., end of a lifetime (EOL). These investigations provided guidelines for designing a reliable Nanosheet FET (NSFET) to investigate and mitigate early aging.","PeriodicalId":159030,"journal":{"name":"2023 IEEE International Reliability Physics Symposium (IRPS)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE International Reliability Physics Symposium (IRPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS48203.2023.10117918","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

Internal and external process variations severely affect the device threshold voltage $(\mathrm{V}_{\text{th}})$ and, in turn, the device's reliability. For the first time, this paper presented a thorough analysis of the self-heating aware $\mathrm{V}_{\text{th}}$ variation of a Nanosheet FET and, thus, the device's aging. Using well-calibrated TCAD models, we evaluated the 'change in $V_{th}\ ^{\prime}$ and performed an extensive design space exploration to analyze: (i) the impact of work function (WF) modulation owing to metal grain sizes and effective grains (for confined dimensions) on $\mathrm{V}_{\text{th}}$ variation; (ii) the impact of ambient temperature (TA) on $\mathrm{V}_{\text{th}}$ variation; (iii) the influence of trap charges on device characteristics; (iv) how the consideration of RDF impacted $\mathrm{V}_{\text{th}};$ (v) the device's aging, i.e., end of a lifetime (EOL). These investigations provided guidelines for designing a reliable Nanosheet FET (NSFET) to investigate and mitigate early aging.
符合工艺和环境温度变化的可靠纳米片场效应管自热感知阈值电压调制
内部和外部进程变化严重影响器件阈值电压$(\ mathm {V}_{\text{th}})$,进而影响器件的可靠性。本文首次深入分析了纳米片场效应管的自热感知$\ mathm {V}_{\text{th}}$变化及其老化。使用校准良好的TCAD模型,我们评估了“$V_{th}\ ^{\prime}$的变化”,并进行了广泛的设计空间探索,以分析:(i)由于金属晶粒尺寸和有效晶粒(有限尺寸)导致的工作函数(WF)调制对$\ mathm {V}_{\text{th}}$变化的影响;(ii)环境温度(TA)对$\ mathm {V}_{\text{th}}$变化的影响;(iii)陷阱电荷对装置特性的影响;(iv)考虑RDF如何影响$\ mathm {V}_{\text{th}};$ (V)设备的老化,即生命周期结束(EOL)。这些研究为设计可靠的纳米片FET (NSFET)来研究和缓解早期老化提供了指导。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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