RF performance of 28nm PolySiON and HKMG CMOS devices

K. Chew, Aniket Agshikar, M. Wiatr, J. S. Wong, W. Chow, Zhihong Liu, T. Lee, Jinglin Shi, S. Lim, K. Sundaram, L. Chan, C. H. Cheng, N. Sassiat, Y. K. Yoo, A. Balijepalli, A. Kumta, C. Nguyen, R. Illgen, A. Mathew, C. Schippel, A. Romanescu, J. Watts, D. Harame
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引用次数: 11

Abstract

The impact of scaling in advanced RF/MS-CMOS has been extensively discussed but there has not been a publication that compares the RF characteristics of 28nm high-K metal gate HKMG and PolySiON technologies fabricated in the same facility. In this work, we show that HKMG improves transistor fT and increases varactor tunning range. However, it can actually decrease fmax. We examine how process features made to optimize cost and digital performance impact the RF performance. Process features which improve DC current and gm, including HKMG also give higher fT. However, fmax is sensitive to gate resistance and PolySiON has an advantage here.
28nm PolySiON和HKMG CMOS器件的射频性能
在先进的RF/MS-CMOS中,缩放的影响已经被广泛讨论,但还没有出版物比较在同一设施中制造的28nm高k金属栅极HKMG和PolySiON技术的RF特性。在这项工作中,我们证明HKMG改善了晶体管的fT并增加了变容调谐范围。然而,它实际上可以降低fmax。我们研究了优化成本和数字性能的工艺特征如何影响射频性能。提高直流电流和gm的工艺特性,包括HKMG,也会带来更高的fT。然而,fmax对栅极电阻很敏感,PolySiON在这方面具有优势。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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