Wafer Scale Package construction and usage for RF through millimeter wave applications

Abstract

WSP (Wafer Scale Packaging) has come on the market for commercial applications in 2008. But how is a WSP constructed and what are its advantages over traditional surface mount techniques? This paper explores how WSP is applied to traditional GaAs PHEMT wafer manufacture as implemented by Avago Technologies in the first volume commercial offering of WSP in 2008. The paper details the general construction and advantages of WSP over plastic, laminate, and ceramic alternate solutions. These advantages include cost, microwave performance, thermal conductance, and size. Detailed examples are shown of products on the general market today and future developments in package and component design.