An accurate scalable and broadband bondpad compact model for GHz RFIC designs

Abstract

This paper describes the effects of substrate resistivity on bondpad parasitic capacitance and resistance. An accurate bondpad model with an embedded substrate model is presented which captures the effects of substrate resistivity variation. Simulated and measured results show as much as a 50% variation in effective bondpad capacitance with varying substrate resistivity. The scalability and broadband characteristics of the model are demonstrated with the achieved model to hardware correlation.