Mixed signal system design course development

H. Tenhunen
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引用次数: 3

Abstract

This paper covers the current curriculum approach to system level integration at Royal Institute of Technology. Our approach is system driven with systematic emphasis of interconnect centric issues in all design phases and abstraction levels. The overall curriculum provides physical, design process (methodology), and functional view of the complex electronic system. Our focus in this paper is to describe the motivation and the specific content of the physical or implementation view. The key feature is enhancing student's capability to build systematically multiple abstractions of the technology and physical issues and constraints for efficient conceptual co-design of ICs and packages and interconnect substrates and for design space exploration. A major effort in Mixed Signal System Design course is devoted for understanding the electrical design and technology issues and interactions of chip and package for complex gigascale integrated systems. The objectives of this new course package is to give Swedish electronics industries world class engineering resources in strategic areas for system integration to final HW/SW products. The overall program is also available as International M.Sc. Program starting fall term 2000.
混合信号系统设计课程开发
本文涵盖了目前英国皇家理工学院系统级集成的课程方法。我们的方法是系统驱动的,系统地强调所有设计阶段和抽象层次的互连中心问题。整个课程提供了复杂电子系统的物理、设计过程(方法论)和功能视图。我们在本文中的重点是描述物理或实施视图的动机和具体内容。主要特点是增强学生系统地构建技术和物理问题的多重抽象的能力,以及有效的集成电路、封装和互连基板的概念协同设计和设计空间探索的约束。混合信号系统设计课程的主要内容是了解复杂的千兆级集成系统的电子设计和技术问题以及芯片和封装的相互作用。这个新课程包的目标是在系统集成到最终硬件/软件产品的战略领域为瑞典电子工业提供世界一流的工程资源。整个课程也可作为国际硕士课程,从2000年秋季学期开始。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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