A trench-gate LIGBT structure and two LMCT structures in SOI substrates

D. Disney, H. Pein, J. Plummer
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引用次数: 14

Abstract

This paper describes a novel SOI trench-gate Lateral Insulated-Gate Bipolar Transistor (LIGBT) structure which exhibits 2.5 times higher latching current densities than an equivalent, conventional LIGBT. This improvement is achieved by allowing most of the hole current to reach the cathode contact without flowing under the N+ source region. In addition, two Lateral MOS-Controlled Thyristor (LMCT) structures in Silicon-on-Insulator (SOI) substrates are presented. These devices achieve on-state performance which is far superior to that of equivalent LIGBT devices, and switching speeds which are nearly equivalent to the LIGBT. The two LMCT configurations are compared in terms of their Maximum Controllable Current (MCC), which exceeds 100 A/cm/sup 2/ for some configurations.
SOI衬底中的沟栅light结构和两种LMCT结构
本文描述了一种新型的SOI沟槽栅横向绝缘栅双极晶体管(light)结构,其锁相电流密度比等效的传统light高2.5倍。这种改进是通过允许大多数空穴电流到达阴极触点而不流过N+源区域来实现的。此外,还提出了两种基于绝缘体上硅(SOI)衬底的mos控制晶闸管(LMCT)结构。这些器件的状态性能远远优于等效的light器件,并且开关速度几乎与light器件相当。比较了两种LMCT配置的最大可控电流(MCC),某些配置的最大可控电流超过100 A/cm/sup 2/。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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