The investigation of recessed channel SOI devices

Xing Zhang, Ru Huang, X. Xi, M. Chan, P. Ko, Yangyuan Wang
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Abstract

Recessed channel SOI devices were investigated. In this paper, the structure and processing of such devices is described in detail. The characteristics of a SOI MOSFET using recessed channel technology are much better than normal thick non-depleted and thin-film fully depleted SOI MOSFETs. The 0.15/spl sim/4.0 /spl mu/m recessed channel SOI MOSFETs with a silicon channel film of 70 nm and a source/drain silicon film of 160 nm are developed using a submicron process. The transconductance and drain current are increased by 40% more than thin-film fully depleted SOI MOSFETs.
嵌入式通道SOI器件的研究
研究了嵌入式通道SOI器件。本文详细介绍了该装置的结构和加工工艺。采用凹槽沟道技术的SOI MOSFET的特性比普通的厚非耗尽和薄膜完全耗尽SOI MOSFET要好得多。采用亚微米工艺制备了具有70 nm硅沟道膜和160 nm硅源/漏极膜的0.15/spl sim/4.0 /spl mu/m凹槽SOI mosfet。跨导和漏极电流比薄膜完全耗尽SOI mosfet增加了40%以上。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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