{"title":"Heterogranular multivariate analytics for detecting and controlling the root causes of the mismatching machines in semiconductor manufacturing","authors":"Aabir Chouichi, J. Blue, C. Yugma, F. Pasqualini","doi":"10.1109/ASMC.2018.8373159","DOIUrl":null,"url":null,"abstract":"In all manufacturing industries, parallel machines/chambers at a single production area are expected to perform identically and, most importantly, to yield similar product quality. However, this is usually not the case in real practice, especially when it is a highly complex industry as is the case for semiconductor fabrication. In this paper, a systematic approach is proposed to detect the root causes of machine/chamber mismatching in real time by exploiting all the available data, such as product measurements, machine sensor readings and maintenance data.","PeriodicalId":349004,"journal":{"name":"2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-04-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 29th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC.2018.8373159","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
In all manufacturing industries, parallel machines/chambers at a single production area are expected to perform identically and, most importantly, to yield similar product quality. However, this is usually not the case in real practice, especially when it is a highly complex industry as is the case for semiconductor fabrication. In this paper, a systematic approach is proposed to detect the root causes of machine/chamber mismatching in real time by exploiting all the available data, such as product measurements, machine sensor readings and maintenance data.