Graphene nanoribbon plasmonic waveguides: Fundamental limits and device implications

S. Rakheja, P. Sengupta
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引用次数: 2

Abstract

The 2D carbon material graphene exhibits strong light-matter interaction over a very wide wavelength range from the far infrared to the ultraviolet [1]. The tunability of the density-of-states and Fermi energy in graphene along with its excellent transport properties provide a path for graphene photonic applications such as quantum optics, photo-voltaics, photo-detectors, and biological sensing [2]. In this paper, we propose exploiting collective electron-light oscillations or plasmons in patterned graphene nano-ribbons (GNRs) for low energy, high-speed on-chip interconnects that can potentially overcome the latency and power constraints of the current copper/low-K on-chip interconnects [3-4]. The contributions of this paper are threefold. First, compact models for evaluating the plasmon-damping rate in GNRs are introduced. The models account for plasmon-damping pathways through phonons (intrinsic and substrate), substrate charged impurities, and edge-states in ribbons. The compact models introduced in this paper are also applicable to other photonic applications of graphene beyond just on-chip interconnects. Secondly, compact models for evaluating the propagation speed and energy consumption of plasmonic waveguides based on their shot-noise limits are introduced. Finally, the fundamental limits and device implications of on-chip plasmonic waveguides are quantified. In particular, propagation speed and energy consumption are compared with copper/low-K on-chip interconnects at advanced technology nodes.
石墨烯纳米带等离子体波导:基本限制和器件意义
二维碳材料石墨烯在从远红外到紫外线的很宽波长范围内表现出强烈的光-物质相互作用[1]。石墨烯的态密度和费米能的可调性及其优异的输运特性为石墨烯的光子应用(如量子光学、光伏、光电探测器和生物传感)提供了一条途径[2]。在本文中,我们提出利用图图化石墨烯纳米带(gnr)中的集体电子光振荡或等离子体,用于低能量、高速片上互连,可以潜在地克服当前铜/低k片上互连的延迟和功率限制[3-4]。本文的贡献有三个方面。首先,介绍了用于评价等离子体阻尼率的紧凑模型。该模型解释了通过声子(本征子和衬底)、衬底带电杂质和带中的边缘态的等离子体阻尼途径。本文介绍的紧凑模型也适用于石墨烯的其他光子应用,而不仅仅是片上互连。其次,介绍了基于脉冲噪声极限的等离子体波导传播速度和能量消耗的紧凑模型。最后,对片上等离子波导的基本限制和器件意义进行了量化。特别是,在先进技术节点上,与铜/低k片上互连的传播速度和能耗进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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