{"title":"An Efficiency and Size Optimized 2GHz 25W Cascaded Doherty RF Power Amplifiers Using GAN HEMTs","authors":"Yoji Murao, K. Ohgami, T. Kaneko","doi":"10.1109/CSICS.2013.6659215","DOIUrl":null,"url":null,"abstract":"NEC has developed a 2.1GHz band very compact and high efficiency power amplifier module based on GaN HEMT cascaded Doherty circuitry. Implemented modules exhibits the amplifier chain power added efficiency of 45% and the final stage drain efficiency of 58% at 25W output level with associated gain of 44dB. The module works well with DPD to achieve -51dBc ACLR using an LTE E-TM1.1 signal with the peak-to-average-power-ratio of 7.1dB. The module occupies only 99cm2. Compact driver stage Doherty circuitry implemented on the multi-layer composite materials PCB contributes both to efficiency enhancement and shrunk foot print.","PeriodicalId":257256,"journal":{"name":"2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","volume":"50 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CSICS.2013.6659215","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
NEC has developed a 2.1GHz band very compact and high efficiency power amplifier module based on GaN HEMT cascaded Doherty circuitry. Implemented modules exhibits the amplifier chain power added efficiency of 45% and the final stage drain efficiency of 58% at 25W output level with associated gain of 44dB. The module works well with DPD to achieve -51dBc ACLR using an LTE E-TM1.1 signal with the peak-to-average-power-ratio of 7.1dB. The module occupies only 99cm2. Compact driver stage Doherty circuitry implemented on the multi-layer composite materials PCB contributes both to efficiency enhancement and shrunk foot print.