In-situ synthesis of graphene on surface of copper powder by rotary CVD and its application in fabrication of reinforced Cu-matrix composites

Qiao-Ping Xiao, X. Yi, B. Jiang, Zehua Qin, Jun Hu, Yong Jiang, Huiqun Liu, Bin Wang, D. Yi
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引用次数: 10

Abstract

A novel approach has been developed for fabricating graphene (Gr) reinforced Cu composites. First, graphene was synthesized in-situ on surface of micron-sized copper powder through rotary chemical vapor deposition (RCVD). Then, the composite powders were hot pressed into bulk Gr-Cu composite pieces in vacuum. During RCVD, methane flow rate controlled the number of layers in synthesized graphene. Analyses of Raman spectroscopy suggested that graphene with varied layer numbers were formed on Cu powder surface. The as-fabricated graphene exhibited a ‘wrinkle’ type morphology with a homogeneous distribution observed by fielde mission scanning electron microscopy (SEM). After hot pressing, the structure and morphology of graphene were preserved in the Gr-Cu bulk composites, as confirmed by high-resolution transmission electron microscopy (HRTEM). Physical and mechanical properties of these bulk composites were studied. They were nearly fully densified and featured with an increase of more than 30% in hardness, as well as similar electrical conductivity and thermal conductivity as compared with pure Cu. The mechanism therein was discussed. Correspondence to: Danqing Yi, School of Materials Science and Engineering, Central South University, Changsha, Hunan 410083, P.R. China,Tel: +86-73188830263; Fax: +86-731-88836320; E-mail: yioffice@csu.edu.cn, danqing@csu. edu.cn
旋转CVD在铜粉表面原位合成石墨烯及其在增强cu基复合材料中的应用
本文提出了一种制备石墨烯(Gr)增强铜复合材料的新方法。首先,通过旋转化学气相沉积(RCVD)在微米级铜粉表面原位合成石墨烯。然后,将复合粉末在真空中热压成块状的Gr-Cu复合片。在RCVD过程中,甲烷流速控制了合成石墨烯的层数。拉曼光谱分析表明,铜粉表面形成了不同层数的石墨烯。通过现场任务扫描电子显微镜(SEM)观察到,制备的石墨烯具有均匀分布的“皱纹”型形态。通过高分辨率透射电子显微镜(HRTEM)证实,热压后石墨烯的结构和形态在Gr-Cu块体复合材料中得到了保留。研究了这些块体复合材料的物理力学性能。它们几乎完全致密化,硬度增加了30%以上,并且与纯Cu相比具有相似的导电性和导热性。讨论了其中的机理。通讯作者:易丹青,中南大学材料科学与工程学院,湖南长沙410083,电话:+86-73188830263;传真:+ 86-731-88836320;电子邮件:yioffice@csu.edu.cn, danqing@csu。edu.cn
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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