Towards optimal adaptive routing in 3D NoC with limited vertical bandwidth

Gunhee Lee, Jinho Lee, Kiyoung Choi
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Abstract

3D NoC is one of the most promising technologies that can overcome the performance barrier of traditional multi-core system. While TSV is the most popular method to realize vertical link for 3D IC, it has many fabrication challenges and the number of TSVs can be limited in practice, thereby limiting vertical bandwidth. Some adaptive routing algorithms have been studied to overcome the bandwidth mismatch. However, there has been no previous study on how much improvement can be achieved by such new algorithms. This paper explores 3D NoC's performance upper-bound beyond which we believe no practically realizable algorithm can reach. We also propose a practically realizable algorithm that achieves performance close to the upper-bound.
三维NoC垂直带宽有限的最优自适应路由研究
3D NoC是克服传统多核系统性能障碍的最有前途的技术之一。虽然TSV是实现3D集成电路垂直链路的最常用方法,但它具有许多制造挑战,并且在实践中TSV的数量有限,从而限制了垂直带宽。为了克服带宽不匹配的问题,研究了一些自适应路由算法。然而,对于这种新算法能取得多大程度的改进,此前还没有研究。本文探讨了三维NoC的性能上限,我们认为没有实际可实现的算法可以达到。我们还提出了一种实际可实现的算法,其性能接近上界。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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