An improved method for i/sub DDT/ testing in the presence of leakage and process variation

A. Chehab, A. Kayssi, A. Nazer, R. Makki
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引用次数: 11

Abstract

We propose in this paper a testing method for CMOS circuits that is insensitive to process variations and leakage levels. This method is based on the transient supply current (i/sub DDT/) and on the observation that current levels for different circuits on a chip scale with different runs of the process. In this method, we introduce a very simple test circuit on-chip. Then, we apply a normalization procedure that allows us to use a single threshold for all chips in different processes without prior knowledge of the process to which the circuit under test belongs. Results from various circuits show that the method is capable of improving the detection capability of threshold-based i/sub DDT/ testing for faults that would otherwise go undetected due to leakage and process variation.
一种在存在泄漏和工艺变化的情况下进行i/sub DDT/测试的改进方法
本文提出了一种对工艺变化和泄漏水平不敏感的CMOS电路测试方法。这种方法是基于瞬态电源电流(i/sub DDT/)和观察芯片上不同电路的电流水平与过程的不同运行。在这种方法中,我们介绍了一个非常简单的片上测试电路。然后,我们应用一个归一化过程,该过程允许我们对不同过程中的所有芯片使用单个阈值,而无需事先了解被测电路所属的过程。各种电路的结果表明,该方法能够提高基于阈值的i/sub DDT/检测故障的检测能力,否则由于泄漏和工艺变化而无法检测到故障。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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