In-suit observations of mechanical stress in Al interconnect line under thermal/electrical conditions

Abstract

In-situ observation of stress in Al interconnects under electromigration and thermal effect by using the synchrotron radiation x-ray diffraction. The test temperature was controlled by changing the current density of W (self-heating structure). The EM-induced stress was also investigated with current densities from 3×105A/cm2 to 4×106A/cm2. The conclusion agreed well with the simulation results.