The Need of Simulation Methodologies for Active Semiconductor Devices in MEMS : Invited Paper

Mike Schwarz
{"title":"The Need of Simulation Methodologies for Active Semiconductor Devices in MEMS : Invited Paper","authors":"Mike Schwarz","doi":"10.23919/MIXDES.2019.8787113","DOIUrl":null,"url":null,"abstract":"The demand of a development/design kit for micro electro mechanical systems (MEMS) is even more in focus than ever before. We present a design flow to ensure an integration of active semiconductor devices into micromechanical sensors. The flow considers cross coupling effects and limitations of the electrical active device and mechanical MEMS. An example of a typical MEMS development including mechanical constraints is given. The results are compared with fabricated devices in terms of accuracy and capability of the design flow. Additionally, the capability of capacitance prediction is offered in comparison with measurements. Finally, the realization of a fast analytical compact model for a Monte Carlo simulation methodology is presented which allows for comprehensive parameter studies and sensitivity analysis’s to identify the most critical process parameters onto the sensor device performance.","PeriodicalId":309822,"journal":{"name":"2019 MIXDES - 26th International Conference \"Mixed Design of Integrated Circuits and Systems\"","volume":"130 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 MIXDES - 26th International Conference \"Mixed Design of Integrated Circuits and Systems\"","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/MIXDES.2019.8787113","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

Abstract

The demand of a development/design kit for micro electro mechanical systems (MEMS) is even more in focus than ever before. We present a design flow to ensure an integration of active semiconductor devices into micromechanical sensors. The flow considers cross coupling effects and limitations of the electrical active device and mechanical MEMS. An example of a typical MEMS development including mechanical constraints is given. The results are compared with fabricated devices in terms of accuracy and capability of the design flow. Additionally, the capability of capacitance prediction is offered in comparison with measurements. Finally, the realization of a fast analytical compact model for a Monte Carlo simulation methodology is presented which allows for comprehensive parameter studies and sensitivity analysis’s to identify the most critical process parameters onto the sensor device performance.
MEMS中有源半导体器件仿真方法的需求:特邀论文
微机电系统(MEMS)开发/设计套件的需求比以往任何时候都更加受关注。我们提出了一个设计流程,以确保有源半导体器件集成到微机械传感器。该流程考虑了电有源器件和机械MEMS的交叉耦合效应和局限性。给出了一个包含机械约束的典型MEMS开发实例。在设计流程的精度和性能方面,将结果与预制器件进行了比较。此外,还提供了电容预测能力,并与测量结果进行了比较。最后,提出了一种蒙特卡罗模拟方法的快速解析紧凑模型的实现,该模型允许进行全面的参数研究和灵敏度分析,以确定对传感器器件性能影响最大的关键工艺参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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