Multiscale thermal design of MCMs with high resolution unstructured adaptive simulation tools

Proceedings 1997 IEEE Multi-Chip Module Conference Pub Date : 1997-02-04 DOI:10.1109/MCMC.1997.569348

A. J. Przekwas, Y. Jiang, Z. Tan

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引用次数: 5

Abstract

A novel computational approach, VPE, has been presented for multi-scale analysis of electronics packaging/cooling. The VPE software system has been designed for fully automated model assembly, grid generation based on compact, reusable electronic component database representation, interactive design, and visualization. Advanced thermal analysis code, CFD-ACE, has been developed with unstructured, solution adaptive grid. The paper has demonstrated a novel concept of unstructured solution adaptive grids for high resolution flow and thermal analysis of electronics components and boards. It was demonstrated on detailed 3D heat transfer studies of MCMs and their assemblies. It has also been demonstrated that a high fidellity multi-scale thermal analysis is possible in which 3D air flow/heat transfer is solved simultaneously with detailed heat condition within individual electronics components. At present, the VPE is being extended for fully automatic design starting from the geometry definition up to the visualization step. A thermal stress module is being linked for full thermo-mechanical analysis.

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基于高分辨率非结构化自适应仿真工具的mcm多尺度热设计

一种新的计算方法，VPE，已经提出了多尺度分析电子封装/冷却。VPE软件系统设计用于全自动模型装配、基于紧凑、可重用电子元件数据库表示、交互设计和可视化的网格生成。先进的热分析代码，CFD-ACE，已开发与非结构化，解决方案自适应网格。本文展示了一种用于高分辨率电子元件和电路板流动和热分析的非结构化解自适应网格的新概念。在mcm及其组件的详细三维传热研究中证明了这一点。还证明了高保真的多尺度热分析是可能的，其中3D空气流动/热传递与单个电子元件内的详细热状况同时解决。目前，VPE正在扩展到从几何定义到可视化步骤的全自动设计。一个热应力模块被连接起来进行全面的热力学分析。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings 1997 IEEE Multi-Chip Module Conference

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