Nanomechanical optical devices fabricated with aligned wafer bonding

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176 Pub Date : 1998-01-25 DOI:10.1109/MEMSYS.1998.659805

C. Gui, G. Veldhuis, T. Koster, P. Lambeck, J. Berenschot, J. Gardeniers, M. Elwenspoek

引用次数: 6

Abstract

This paper reports on a new method for making some types of integrated optical nanomechanical devices. Intensity modulators as well as phase modulators were fabricated using several silicon micromachining techniques, including chemical mechanical polishing and aligned wafer bonding. This new method enables batch fabrication of the nanomechanical optical devices, and enhances their performance.

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排列晶圆键合制备纳米机械光学器件

本文报道了一种制作若干类型的集成光学纳米机械器件的新方法。强度调制器和相位调制器采用了几种硅微加工技术，包括化学机械抛光和对准晶圆键合。该方法实现了纳米机械光学器件的批量制造，提高了器件的性能。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings MEMS 98. IEEE. Eleventh Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Systems (Cat. No.98CH36176

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