Electromagnetic modeling of shielding enclosure for chip structures

Qing Xu, M. Tong
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Abstract

Electromagnetic compatibility (EMC) design for chip structures requires an accurate electromagnetic (EM) modeling and analysis for involved shielding enclosures which are usually made of conductors. The shielding effectiveness of the enclosure can be evaluated through solving for the electric field inside the enclosure. Traditionally, the problem can be solved by the method of moments (MoM) in integral equation approach, but we propose a Nyström scheme to solve it. The Nyström scheme has several merits compared to the MoM, but it has not been used to analyze the EMC problems with very thin conductors. A numerical example is presented to demonstrate the scheme and good results have been obtained.
芯片结构屏蔽外壳的电磁建模
芯片结构的电磁兼容性(EMC)设计需要对所涉及的屏蔽外壳(通常由导体制成)进行精确的电磁(EM)建模和分析。通过求解箱体内电场,可以评价箱体的屏蔽效果。传统上,该问题可以用积分方程中的矩量法(MoM)来解决,但我们提出了一个Nyström方案来解决该问题。Nyström方案与MoM方案相比有许多优点,但尚未用于分析超薄导体的电磁兼容问题。最后通过一个算例对该方案进行了验证,取得了良好的效果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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