High performance 0.1- mu m room temperature Si MOSFETs

R. Yan, K. Lee, D. Jeon, Y.O. Kim, B. Park, M. Pinto, C. Rafferty, D. Tennant, E. Westerwick, G. Chin, M. Morris, K. Early, P. Mulgrew, W. Mansfield, R. Watts, A.M. Voshchenkov, J. Bokor, R. Swartz, A. Ourmazd
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引用次数: 19

Abstract

The design and implementation of 0.15- mu m-channel N-MOSFETs with very high current drive and good short channel behavior at room temperature are discussed. Measured subthreshold characteristics show a slope of 84 mV/dec and a shift for 75 mV for Delta V/sub ds/=1 V. A peak g/sub m/ of 570 mS/mm was recorded, leading to a unity-current-gain cutoff frequency (f/sub T/) of 89 GHz. Key process steps include the formation of 40-AA gate oxides and sub-500-AA junctions. Vertical doping engineering was used to minimize doping at the surface and beneath the junctions, while maintaining good turn-off characteristics.<>
高性能0.1 μ m室温硅mosfet
讨论了室温下具有高电流驱动和良好短沟道性能的0.15 μ m沟道n - mosfet的设计与实现。测量的亚阈值特性显示,当δ V/sub /=1 V时,斜率为84 mV/dec,位移为75 mV。记录到峰值g/sub m/为570 mS/mm,导致单位电流增益截止频率(f/sub T/)为89 GHz。关键的工艺步骤包括形成40-AA栅极氧化物和低于500- aa的结。垂直掺杂工程用于减少表面和结下的掺杂,同时保持良好的关断特性
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