Sliding friction, wear and tribofilm formation of silver films electro-plated on copper alloy sheets

2016 IEEE 62nd Holm Conference on Electrical Contacts (Holm) Pub Date : 2016-10-01 DOI:10.1109/HOLM.2016.7780021

Song-Zhu Kure-Chu, Rie Nakagawa, T. Ogasawara, H. Yashiro, S. Sawada, A. Shimizu, Y. Saitoh

{"title":"Sliding friction, wear and tribofilm formation of silver films electro-plated on copper alloy sheets","authors":"Song-Zhu Kure-Chu, Rie Nakagawa, T. Ogasawara, H. Yashiro, S. Sawada, A. Shimizu, Y. Saitoh","doi":"10.1109/HOLM.2016.7780021","DOIUrl":null,"url":null,"abstract":"This study is aimed at clarifying the mechanism of wear process for Ag plating through a one-way sliding wear test. The samples of different hardness Ag plating on copper alloys were prepared as coupon and embossment specimens, which simulated terminal contacts. During the sliding test, the contact resistance and the friction coefficient are measured. The surface and cross-section morphologies, roughness, tribo-film formation, and wear volume of the Ag films after wear tests were investigated and the wear mechanism was discussed. As results, the hard Ag plating film (120 Hv) exhibited higher contact resistance comparing to the soft Ag plating film (80 Hv). The soft Ag film delivered a larger wear scar on embossment and wider wear trace on coupon specimens compared to the hard one. The overall wear volume of hard Ag film was less than that of soft Ag film, which can be attributed to the fine crystalline structure of hard Ag. Moreover, the observation of tribofilms formed on the Ag films after wear tests suggested that a mixed-type of adhesive and abrasive wears occurred for both of soft and hard Ag films.","PeriodicalId":117231,"journal":{"name":"2016 IEEE 62nd Holm Conference on Electrical Contacts (Holm)","volume":"184 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE 62nd Holm Conference on Electrical Contacts (Holm)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HOLM.2016.7780021","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 4

Abstract

This study is aimed at clarifying the mechanism of wear process for Ag plating through a one-way sliding wear test. The samples of different hardness Ag plating on copper alloys were prepared as coupon and embossment specimens, which simulated terminal contacts. During the sliding test, the contact resistance and the friction coefficient are measured. The surface and cross-section morphologies, roughness, tribo-film formation, and wear volume of the Ag films after wear tests were investigated and the wear mechanism was discussed. As results, the hard Ag plating film (120 Hv) exhibited higher contact resistance comparing to the soft Ag plating film (80 Hv). The soft Ag film delivered a larger wear scar on embossment and wider wear trace on coupon specimens compared to the hard one. The overall wear volume of hard Ag film was less than that of soft Ag film, which can be attributed to the fine crystalline structure of hard Ag. Moreover, the observation of tribofilms formed on the Ag films after wear tests suggested that a mixed-type of adhesive and abrasive wears occurred for both of soft and hard Ag films.

查看原文本刊更多论文

铜合金片上电镀银膜的滑动摩擦、磨损及摩擦膜的形成

本研究旨在通过单向滑动磨损试验阐明镀银磨损过程的机理。制备了不同硬度的铜合金镀银试样，分别作为压片试样和压花试样，模拟了铜合金的端子接触。在滑动试验中，测量了接触阻力和摩擦系数。研究了磨损后银膜的表面形貌、横截面形貌、粗糙度、摩擦膜形成和磨损体积，并对磨损机理进行了探讨。结果表明，硬镀银膜(120hv)的接触电阻高于软镀银膜(80hv)。软银膜比硬银膜在压纹上产生更大的磨损疤痕，在压纹试样上产生更宽的磨损痕迹。硬银膜的整体磨损体积小于软银膜，这可归因于硬银的细晶结构。此外，对磨损试验后银膜上形成的摩擦膜的观察表明，软、硬银膜均发生黏着磨损和磨粒磨损的混合类型。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

2016 IEEE 62nd Holm Conference on Electrical Contacts (Holm)

自引率

0.00%

发文量