Case Study on Package Level Defect Localization through Optimized Lock-in Thermography Frequency

Abstract

This case study outlines the successful package-level failure site detection by optimizing the Lock-In Thermography (LIT) frequency based on resistance, combined with 3D X-ray for locating the defect and EDX (Energy Dispersive X-ray) for root-cause analysis. By optimizing the lock-in frequency, the exact location of the defect on the package was identified, thus, leading to effective determination of failure mechanism and accurate root cause investigation.