Inspecting surface mounted devices using k nearest neighbor and Multilayer Perceptron

Alexandre Reeberg de Mello, M. Stemmer
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引用次数: 9

Abstract

Automatic inspection of electronic components during the production of printed circuit boards is a way to ensure the quality of this production, reducing the cost of re-work. An automatic optical inspection system based on AI techniques for surface mounted devices is proposed in this work. The method relies on extracting the contour and histogram related features of component images, using Watershed segmentation, Canny edge detection, border following algorithm and histogram analysis. Histogram related features are applied in the k nearest neighbor technique with the goal of identifying the existence of a component. Contour related features are used to identify changes in angle and position by a comparison method and also to classify the component using a Multilayer Perceptron (MLP) neural network. Both techniques were used in the inspection system with the chosen features, and are validated through the 10-fold cross validation data method.
使用k近邻和多层感知器检测表面安装的设备
印制电路板生产过程中电子元件的自动检测是保证这种生产质量,减少返工成本的一种方式。提出了一种基于人工智能技术的表面贴装器件自动光学检测系统。该方法依赖于提取分量图像的轮廓和直方图相关特征,采用分水岭分割、Canny边缘检测、边界跟踪算法和直方图分析。直方图相关特征应用于k近邻技术,目的是识别组件的存在性。轮廓相关特征通过比较方法识别角度和位置的变化,并使用多层感知器(MLP)神经网络对组件进行分类。这两种技术都被用于具有所选特征的检测系统中,并通过10倍交叉验证数据方法进行验证。
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