A 16nm 256-bit wide 89.6GByte/s total bandwidth in-package interconnect with 0.3V swing and 0.062pJ/bit power in InFO package

Abstract

● An in-package interconnect for in-package memory application in InFO package has been demonstrated ■ Technology: TSMC 16FF + InFO ● 89.6GByte/s total bandwidth is achieved with 256-DQ operating in 2.8Gbit/s and 0.3V-swing ■ Low power: IO (0.062pJ/bit); PHY (0.424pJ/bit) ■ Low latency: Write (4.75T+1.5T=6.25T); Read (2+1.875=3.875T) ● 0.3V signal integrity on the un-probed IO has been clarified ■ 420ps (0.84UI) Eye width; 225mV (75%) Eye height ● Prompt and automatic timing-calibration scheme