High speed interconnect optimization

Mallikarjun Vasa, Arun Chada Reddy, B. Mutnury, Sanjay Kumar, R. Vasanth
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引用次数: 3

Abstract

As the signal speeds begin to increase, small routing imperfections start to dictate the overall channel performance. Commonly found routing imperfections such as trace breakout, via discontinuity and AC coupling capacitor pad capacitance need to be further optimized to meet the desired channel specification based on bit error rate (BER). Upfront modeling and analysis of such imperfections at high frequencies can mitigate expensive board redesigns to achieve the desired performance. This paper demonstrates the impact of each such routing imperfection(s) for data rates up to 40 Gbps. Model to hardware correlation is performed to ensure model accuracy. The impact physical routing parameters on return and insertion loss in frequency and time domain are studied to help designers optimize their channel.
高速互连优化
当信号速度开始增加时,小的路由缺陷开始决定整个信道的性能。常见的布线缺陷,如走线断线、通过不连续和交流耦合电容垫电容需要进一步优化,以满足基于误码率(BER)的所需通道规格。在高频下对这些缺陷进行前期建模和分析可以减少昂贵的电路板重新设计,以实现所需的性能。本文演示了每种路由缺陷对高达40 Gbps的数据速率的影响。进行了模型与硬件的关联,保证了模型的准确性。研究了物理路由参数在频域和时域上对回波和插入损耗的影响,以帮助设计人员优化信道。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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