An integrated approach to power electronics systems

Proceedings of the Power Conversion Conference-Osaka 2002 (Cat. No.02TH8579) Pub Date : 2002-08-07 DOI:10.1109/PCC.2002.998503

F. Lee, J. Daan van Wyk, D. Boroyevich, P. Barbosa

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引用次数: 35

Abstract

Power electronics systems are typically designed and manufactured using nonstandard parts, which results in labor-intensive manufacturing processes and increased cost. As a possible way to overcome these problems, this paper provides an overview of an integrated approach to design and realize power electronics systems, aiming at improved performance, reliability, manufacturability and cost effectiveness. A brief discussion is presented on the technology barriers that limit the rapid growth of power electronics, such as passive components and packaging techniques. It is also discussed the technology advancements needed to improve the characteristics of power electronics systems, such as increased levels of integration, standardization of parts and improved packaging techniques for enhanced thermal management and electrical performance. The technologies being developed for the realization of integrated systems include planar metalization to allow three-dimensional structural integration of power devices and control functions, integration of power passives, and integration of electrical/thermal design tools.

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电力电子系统的集成方法

电力电子系统通常使用非标准件设计和制造，这导致劳动密集型制造过程和成本增加。作为克服这些问题的可能途径，本文概述了设计和实现电力电子系统的集成方法，旨在提高性能、可靠性、可制造性和成本效益。简要讨论了限制电力电子快速发展的技术障碍，如无源元件和封装技术。还讨论了改善电力电子系统特性所需的技术进步，例如提高集成度、部件标准化和改进的封装技术，以增强热管理和电气性能。为实现集成系统而开发的技术包括平面金属化，以实现电力设备和控制功能的三维结构集成，电力无源的集成以及电气/热设计工具的集成。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of the Power Conversion Conference-Osaka 2002 (Cat. No.02TH8579)

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