MOCVD growth and device characterization of InP/GaAsSb/InP DHBTs with a GaAs spacer

T. Hoshi, H. Sugiyama, H. Yokoyama, N. Kashio, K. Kurishima, M. Ida, H. Matsuzaki
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Abstract

This paper describes the impact of a GaAs spacer inserted between the InP emitter and GaAsSb base of InP/GaAsSb/InP double-heterojunction bipolar transistors (DHBTs) grown by metalorganic chemical vapor deposition. The GaAs spacer suppresses the incorporation of excess Sb atoms from the GaAsSb base into the InP emitter, which reduces the recombination current at the junction. The fabricated DHBTs with a 0.5-μm-wide emitter show dc current gain of over 90 at current density (JC) of 10 mA/μm2. The 0.25-μm-emitter DHBTs yield current-gain cut-off frequency (ft) of 384 GHz and maximum oscillation frequency (fmax) of 264 GHz at JC of 14 mA/μm2.
带有GaAs间隔层的InP/GaAsSb/InP dhbt的MOCVD生长和器件表征
本文研究了金属有机化学气相沉积法生长的InP/GaAsSb/InP双极异质结晶体管(DHBTs)中,在InP发射极和GaAsSb基极之间插入GaAs衬垫对其性能的影响。GaAs间隔层抑制了过量的Sb原子从GaAsSb基底进入InP发射极,从而降低了结处的复合电流。在电流密度(JC)为10 mA/μm2时,所制备的发射极宽度为0.5 μm的DHBTs的直流增益大于90。在JC为14 mA/μm2时,0.25 μm-发射极dhbt的电流增益截止频率为384 GHz,最大振荡频率为264 GHz。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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