E. Simoen, A. Veloso, B. O’Sullivan, K. Takakura, C. Claeys
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引用次数: 1
Abstract
The paper gives an overview of low-frequency noise studies in advanced semiconductor devices, targeting at different applications. As will be shown, the choice of substrate (bulk Si versus SOI) determines to a large extent the noise behavior of Gate-AII-Around (GAA) Vertical Nanowire (VNW) FETs. While no shot noise above 100 Hz is found for devices on SOI, the dominant flicker noise is of number fluctuations origin, in contrast to mobility fluctuations for the devices with a back-silicon source contact on bulk. It will be shown that the 1/f noise of Si-doped orthorhombic Hf02 is a factor of three lower than for paraelectric Hf02. Finally, the noise performance for GaN-on-Si based HEMTs, MOSHEMTs and MOSFETs will be compared and briefly discussed.
本文针对不同的应用,综述了先进半导体器件中低频噪声的研究。如图所示,衬底的选择(大块硅与SOI)在很大程度上决定了栅极- ai - around (GAA)垂直纳米线(VNW)场效应管的噪声行为。虽然在SOI上的器件没有发现100 Hz以上的散粒噪声,但主要的闪烁噪声是数字波动的来源,与块体上具有硅源后接触的器件的迁移率波动形成对比。结果表明,掺硅正交正交型Hf02的1/f噪声比准电型Hf02低3倍。最后,对GaN-on-Si基hemt、moshemt和mosfet的噪声性能进行了比较和简要讨论。