Thermal performance characteristic comparison between flip-chip wirebond ceramic multichip modules

Abstract

Multichip module (MCM) thermal performance for flip chip and wirebond (WE) die attach packages are evaluated using four chip, uniform size ceramic substrates. Thermal characteristics of each module are evaluated by conduction parametric analyser of individual module element properties and dimensions. Thermal performance is evaluated for conditions ranging from low air now and no heat sink to high air flow with high profile heat sinks. Flip chip modules are shown to be thermally superior to WB packages in both cavity up and cavity down configurations.