A New Washingless Hybrid-mounting Technique For Bare Chip ICs And SMDs

Abstract

With the development of SMT(Surface Mount Technology), the semiconductor mounting technique is becoming more important than ever. We have debeloped a new hybrid-mounting technique for bare chip ICs and SMDs, which does not require a washing process. Until now washing process was essential for hybrid mounting because the bare chip ICs were mounted after reflow soldering of the SMDs. We have succeeded in eliminating the washing process by changing the order of mounting the SMDs and ICs ,and by developing a new metal screen mask.