Impact of device design parameters on VDSAT and analog performance of TFETs

Abhishek Acharya, S. Dasgupta, B. Anand
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引用次数: 1

Abstract

We report the impact of device design parameters on the saturation voltages (VDSAT) and thereby on analog performance of the Tunnel FETs (TFET). As the drain bias (VDS) increases, the device initially enters a soft saturation and later into a deep saturation state, both at a constant difference between the gate-drain bias (VGD)· An increase in source (drain) doping decreases (increases) the soft saturation voltage. The short channel lengths degrade the saturation in the TFETs. Agate-drain underlapcauses early onset of the saturation in TFETs, while, a reduction in the nanowire diameter delays the saturation. The output resistance (Ro), transconductance (gm), and intrinsic gain (gm×Ro) increase when the device enters in soft saturation and attain a maxi mum in the deep saturation state. Our work elucidates the physics behind above observations, and provides insights into the device design of the TFETs.
器件设计参数对tfet VDSAT和模拟性能的影响
我们报告了器件设计参数对饱和电压(VDSAT)的影响,从而影响隧道场效应管(TFET)的模拟性能。随着漏极偏压(VDS)的增加,器件最初进入软饱和状态,随后进入深饱和状态,两者在栅极-漏极偏压(VGD)之间的差值不变。源(漏极)掺杂的增加降低(增加)软饱和电压。较短的通道长度降低了tfet的饱和。玛瑙漏极下漏导致tfet的饱和提前发生,而纳米线直径的减小则延迟了饱和的发生。当器件进入软饱和状态时,输出电阻(Ro)、跨导(gm)和固有增益(gm×Ro)增加,并在深饱和状态下达到最大值。我们的工作阐明了上述观察背后的物理原理,并为tfet的器件设计提供了见解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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