Recent advances in dielectric breakdown of modern gate dielectrics

E. Wu, J. Suñé
{"title":"Recent advances in dielectric breakdown of modern gate dielectrics","authors":"E. Wu, J. Suñé","doi":"10.1109/IIRW.2013.6804141","DOIUrl":null,"url":null,"abstract":"In this talk, we first review the first BD and post BD statistics of high-k/SiO2 bilayer films (or high-κ stacks) by delineating similarities and differences from SiO2 single-layer films. Then, we will discuss the recent progress on TDDB voltage and temperature dependence in a two-step model of species-release and reaction process. This model is found to be applicable to both SiO2 and high-κ stacks (pFET inversion mode) and provide a sound physical picture for overall BD process. Finally, we will highlight the challenges in AC TDDB reliability, specifically related to nFET inversion mode of high-k stacks.","PeriodicalId":287904,"journal":{"name":"2013 IEEE International Integrated Reliability Workshop Final Report","volume":"41 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Integrated Reliability Workshop Final Report","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IIRW.2013.6804141","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

Abstract

In this talk, we first review the first BD and post BD statistics of high-k/SiO2 bilayer films (or high-κ stacks) by delineating similarities and differences from SiO2 single-layer films. Then, we will discuss the recent progress on TDDB voltage and temperature dependence in a two-step model of species-release and reaction process. This model is found to be applicable to both SiO2 and high-κ stacks (pFET inversion mode) and provide a sound physical picture for overall BD process. Finally, we will highlight the challenges in AC TDDB reliability, specifically related to nFET inversion mode of high-k stacks.
现代栅极电介质的介电击穿研究进展
在本次演讲中,我们首先回顾了高k/SiO2双层膜(或高κ堆栈)的首个BD和后BD统计数据,并描述了与SiO2单层膜的异同。然后,我们将讨论TDDB在物种释放和反应过程两步模型中电压和温度依赖性的最新进展。该模型适用于SiO2和高κ堆栈(pet反演模式),并为整个BD过程提供了良好的物理图像。最后,我们将重点介绍交流TDDB可靠性方面的挑战,特别是与高k堆栈的nFET反转模式相关的挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信