Thin-film heterojunction field-effect transistors for ultimate voltage scaling and low-temperature large-area fabrication of active-matrix backplanes

B. Hekmatshoar, A. Afzali-Ardakani
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引用次数: 3

Abstract

Thin-Film heterojunction field-effect transistor (HJFET) devices with crystalline Si (c-Si) channels and gate regions comprised of hydrogenated amorphous silicon (a-Si:H) or organic materials are demonstrated. The HJFET devices are processed at 200°C and room temperature, respectively; and exhibit operation voltages below 1V, subthreshold slopes in the range of 70-100mV/dec and off-currents as low as 25 fA/μm. The HJFET devices are proposed for use in active matrix backplanes comprised of low-temperature poly-Si (LTPS) as the c-Si substrate. Compared to conventional LTPS devices which require process temperatures up to 600°C and complex fabrication steps, the HJFET devices offer lower process temperature, simpler fabrication steps and lower operation voltages without compromising leakage or stability.
薄膜异质结场效应晶体管的极限电压缩放和低温大面积制造有源矩阵背板
本文演示了薄膜异质结场效应晶体管(HJFET)器件,该器件具有晶体硅(c-Si)通道和由氢化非晶硅(a-Si:H)或有机材料组成的栅极区。HJFET器件分别在200℃和室温下加工;工作电压低于1V,亚阈值斜率在70-100mV/dec范围内,关断电流低至25 fA/μm。该HJFET器件被提议用于由低温多晶硅(LTPS)作为c-Si衬底组成的有源矩阵背板。与需要高达600°C工艺温度和复杂制造步骤的传统LTPS器件相比,HJFET器件提供更低的工艺温度,更简单的制造步骤和更低的工作电压,而不会影响泄漏或稳定性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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