Computational patterning and process variation impact on photonics devices

M. Chalony, L. Melvin, R. Zimmermann, B. Küchler, Emilie Viasnoff, R. Scarmozzino, D. Herrmann, Y. Saad, P. Stopford, Thuc H. Dam, U. Klostermann, W. Demmerle, Al Blais, R. Stoffer
{"title":"Computational patterning and process variation impact on photonics devices","authors":"M. Chalony, L. Melvin, R. Zimmermann, B. Küchler, Emilie Viasnoff, R. Scarmozzino, D. Herrmann, Y. Saad, P. Stopford, Thuc H. Dam, U. Klostermann, W. Demmerle, Al Blais, R. Stoffer","doi":"10.1117/12.2658788","DOIUrl":null,"url":null,"abstract":"With the introduction of Augmented Reality, Virtual Reality, and Mixed Reality (AR/VR/MR) applications, the fabrication of photonics devices is approaching a high volume manufacturing level. To scale these products to consumer friendly dimensions, there is still significant shrink needed for many not yet available components such as ultrasmall cameras, metalenses, microdisplays, and combiner optics. AR/VR/MR optical components include metalenses patterned over large areas, and the fidelity of these patterns may have a significant impact on performance. In this study, we apply OPC to the design intent and examine the implication of various lithographic and correction techniques on metalens performance through simulation. In addition, we investigate the root causes of the manufacturing process variability and its impact on metalens functionality. These devices are analyzed by comparing light propagation through the simulated manufactured system using rigorous lithographic models to the optimal system based on the design intent. The study finds that the size and shape of meta-atoms have a different impact on optical performance, depending on the type of the metalens.","PeriodicalId":212235,"journal":{"name":"Advanced Lithography","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Advanced Lithography","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.2658788","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

With the introduction of Augmented Reality, Virtual Reality, and Mixed Reality (AR/VR/MR) applications, the fabrication of photonics devices is approaching a high volume manufacturing level. To scale these products to consumer friendly dimensions, there is still significant shrink needed for many not yet available components such as ultrasmall cameras, metalenses, microdisplays, and combiner optics. AR/VR/MR optical components include metalenses patterned over large areas, and the fidelity of these patterns may have a significant impact on performance. In this study, we apply OPC to the design intent and examine the implication of various lithographic and correction techniques on metalens performance through simulation. In addition, we investigate the root causes of the manufacturing process variability and its impact on metalens functionality. These devices are analyzed by comparing light propagation through the simulated manufactured system using rigorous lithographic models to the optimal system based on the design intent. The study finds that the size and shape of meta-atoms have a different impact on optical performance, depending on the type of the metalens.
计算模式和工艺变化对光子器件的影响
随着增强现实、虚拟现实和混合现实(AR/VR/MR)应用的引入,光子器件的制造正在接近大批量制造水平。为了将这些产品扩展到消费者友好的尺寸,许多尚未可用的组件(如超小型相机、超透镜、微型显示器和组合光学)仍然需要大幅缩小。AR/VR/MR光学组件包括大面积图案的超透镜,这些图案的保真度可能对性能产生重大影响。在本研究中,我们将OPC应用于设计意图,并通过仿真研究各种光刻和校正技术对超构透镜性能的影响。此外,我们还研究了制造工艺变异性的根本原因及其对超构功能的影响。通过比较采用严格光刻模型的模拟制造系统与基于设计意图的最优系统的光传播,对这些器件进行了分析。研究发现,元原子的大小和形状对光学性能有不同的影响,这取决于超构透镜的类型。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信