Si (100) and Si (311) - A comparative study for nanofabrication

N. Moldovan, R. Divan
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引用次数: 1

Abstract

Bulk micromachining was mainly developed for Si (100) and Si (110) wafers and is based on crystallographic etching of silicon in KOH and other basic solutions, in order to obtain useful 3-dimensional structures. Recently, Si (311) joined the group of useful substrates for nanomanufacturing, but a thorough description of its capabilities was not yet reported. The hereby study investigates the particularities of crystal-orientation dependent etching of Si (311) wafers in comparison with Si (100) in some of the most popular solutions used for etching. By that, the experimental study adds to the base of knowledge of Si anisotropic etching and diversifies its capabilities. Of particular interest is Si (311)'s capability to form V-grooves of three-faceted pyramid shape, useful for forming wedge-free tips for subsequent molding, which can be exploited to form tips with sub-10 nm apex radii.
Si(100)和Si(311) -纳米制造的比较研究
体微加工主要针对Si(100)和Si(110)晶圆进行,其基础是在KOH和其他碱性溶液中对硅进行晶体刻蚀,以获得有用的三维结构。最近,Si(311)加入了用于纳米制造的有用衬底组,但其能力的详细描述尚未报道。本文研究了在一些最常用的蚀刻溶液中,Si(311)晶圆与Si(100)晶圆的晶体取向依赖蚀刻的特殊性。通过实验研究,增加了硅各向异性刻蚀的知识基础,丰富了其功能。特别令人感兴趣的是Si(311)形成三面金字塔形状的v形凹槽的能力,这对于形成用于后续成型的无楔尖端有用,可用于形成顶端半径低于10 nm的尖端。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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