Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers

Abstract

High yield reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology is proposed for ultra-high density 2.5D/3D integration applications. New mCoW hybrid bonding technology use shallow-recess oxide structure, electro-less plated capping layers, and thin glue adhesive layer below 1um to avoid the issues of current standard CoW bonding technology. Multi numbers of TEG die with 7mm × 23mm size are simultaneously aligned with high accuracy around 1um using chip self-assembly technology and thermal-compression bonded by in batch. In the TEG chip, totally 684,000 electrode daisy chain comprising of 3μm diameter/6um pitch tiny Cu electrodes are well intact joined by new reconfigured mCoW hybrid bonding technology.