P. de Langhe, L. Martens, D. De Zutter, D. Morlion
{"title":"Transfer impedance measurements on the shielding of a multi-pins board-to-board connector","authors":"P. de Langhe, L. Martens, D. De Zutter, D. Morlion","doi":"10.1109/ISEMC.1994.385606","DOIUrl":null,"url":null,"abstract":"A new triaxial test fixture has been developed for measuring the transfer impedance of the shield of a board-to-board or backplane connector. A lot of attention has been paid to the design of the outer and inner line of the test cell. As a reference, first transfer impedance measurements were done on a commonly used coaxial cable where a good agreement with literature results was found. Various configurations of the connector shield were further measured and compared, showing a large influence of the omission of side and bottom parts of the connector shields.<<ETX>>","PeriodicalId":154914,"journal":{"name":"Proceedings of IEEE Symposium on Electromagnetic Compatibility","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-08-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.1994.385606","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
A new triaxial test fixture has been developed for measuring the transfer impedance of the shield of a board-to-board or backplane connector. A lot of attention has been paid to the design of the outer and inner line of the test cell. As a reference, first transfer impedance measurements were done on a commonly used coaxial cable where a good agreement with literature results was found. Various configurations of the connector shield were further measured and compared, showing a large influence of the omission of side and bottom parts of the connector shields.<>