AI Powered THz VLSI Testing Technology

Abstract

Increasing complexity of digital and mixed-signal systems makes establishing the authenticity of a chip to be a challenging problem. We present a new terahertz testing technique for non-destructive identification of genuine integrated circuits, in package, in-situ and either with no or under bias, by measuring their response to scanning terahertz and sub-terahertz radiation at the circuit pins. This novel, patent pending non-invasive nondestructive technology when merged with Artificial Intelligence (AI) engine will evolve and self-improve with each test cycle. By establishing and AI processing of the THz scanning signatures of reliable devices and circuits and comparing this signatures with devices under test using AI, this technology could be also used for reliability and lifetime prediction.