A Compact Model for the Electroforming Process of Memristive Devices

C. L. Torre, A. Kindsmüller, S. Son, R. Waser, V. Rana, S. Menzel
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引用次数: 1

Abstract

Memristive devices based on the valence change mechanism undergo an electroforming process before they can be switched repetitively between different resistance states. This electroforming process can already lead to device-to-device variability in a memristive array. Here, we propose a physics-based compact model for the electroforming process of filamentary memristive switches based on the valence change mechanism. The model is verified by experimental data of ZrOx-based devices. Using this model, the forming process of a whole memory array is investigated. It is shown that the parasitic IR-drop of the word and bit lines can influence the final state of the device after the electroforming process. In addition, the simulation results reveal that the location of the cell in the array influences the final state.
忆阻器件电铸过程的紧凑模型
基于价变机制的忆阻器件在可在不同电阻状态之间反复切换之前,要经历电铸过程。这种电铸工艺已经可以导致忆阻阵列中器件之间的可变性。在这里,我们提出了一个基于价变化机制的丝状记忆开关电铸过程的物理紧凑模型。用基于zrox的器件的实验数据验证了模型的正确性。利用该模型,研究了整个存储阵列的形成过程。结果表明,字线和位线的寄生ir降会影响电铸后器件的最终状态。此外,仿真结果表明,单元格在阵列中的位置对最终状态有影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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