Process Control Challenges and Solutions for Advanced Semiconductor Devices

Y. Jee, Sang Hyun Han, S. Wolfling
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Abstract

We report on the challenges of process control for advanced semiconductor devices and comprehensive solutions to overcome them. The challenges arise in the environment of 3D structures and process complexity where pitch decreases and aspect ratio increases at advanced technology nodes. In this work we will summarize how various strategies, including the Lab to Fab conversion of new source technology, are being implemented through several cases. We will also outline the need for further improvement.
先进半导体器件的过程控制挑战和解决方案
我们报告了先进半导体器件过程控制的挑战以及克服这些挑战的综合解决方案。在3D结构和工艺复杂的环境中,在先进的技术节点上,螺距减小,长宽比增加,挑战就出现了。在这项工作中,我们将通过几个案例总结如何实施各种策略,包括新源技术的实验室到Fab转换。我们还将概述进一步改进的需要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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