Macromodels for generating signal integrity and timing management advice for package design

P. Franzon, S. Simovich, S. Mehrotra, M. Steer
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引用次数: 8

Abstract

The electrical design of packaging for high speed digital systems requires intensive efforts on the part of signal integrity engineers. We have produced a set of tools that assist these engineers in efficiently producing PCB and MCM designs that meet timing and other electrical needs. This paper describes the most important aspect of this solution, the internal 'macromodels' that accurately capture the relationships between electrical/timing design and the package physical design (or layout).<>
用于生成信号完整性和时序管理建议的宏模型
高速数字系统封装的电气设计需要信号完整性工程师付出大量的努力。我们已经生产了一套工具,帮助这些工程师有效地生产满足时序和其他电气需求的PCB和MCM设计。本文描述了该解决方案最重要的方面,即内部“宏模型”,它准确地捕捉了电气/时序设计与封装物理设计(或布局)之间的关系。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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