Investigation on Heat Dissipation Performance of a Multi-channel Digital Array Module

Abstract

With the emergence of high-power and highly integrated digital array radar, the heat dissipation of digital array module is becoming increasingly prominent. In this study, the thermal design of a multi-channel digital array module was investigated. A liquid-filled cold plate for structural support and heat dissipation was designed, on which double-layer bumps were proposed to enhance the heat conduction path of internal devices, and the heat transfer process of the digital array module was analyzed by thermal simulation. The results show that the temperatures of all devices in the digital array module are below 85°C, which meets the design requirements. Meanwhile, the influence of the bump’s layout and width on the device temperature was analyzed, and the heat dissipation mechanism of the double-layer bumps was revealed. The design ideas proposed in this paper can provide more effective solutions for the heat dissipation of a multi-channel digital array module.