Terahertz Detection and Imaging Systems and Applications

2016 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS) Pub Date : 2016-10-01 DOI:10.1109/CSICS.2016.7751068

E. Grossman, J. Cheron

引用次数: 2

Abstract

We describe packaging challenges for the development of practical THz imagers based on InP transistor circuits. Very high aspect ratio (>20:1) die singulation and additive manufacturing for waveguide housings are shown to help in addressing these challenges.

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太赫兹探测和成像系统及其应用

我们描述了开发基于InP晶体管电路的实用太赫兹成像仪的封装挑战。非常高的宽高比(>20:1)的芯片模拟和波导外壳的增材制造有助于解决这些挑战。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2016 IEEE Compound Semiconductor Integrated Circuit Symposium (CSICS)

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