A comparative study by TCAD simulation for two different n-in-p silicon particle detector structures

M. Mekheldi, S. Oussalah, A. Lounis, Nourredine Brihi
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引用次数: 0

Abstract

This paper presents a comparative study for two different n-in-p silicon particle detector structures in the purpose of evaluating the breakdown voltage of unirradiated devices candidate for high luminosity applications. The two structures based on the n-in-p technology with and without p-spray isolation between guard rings have been simulated on high resistivity silicon wafers. The simulated electrical characteristics current-voltage, for both structures, are compared for various parameters like, substrate thickness, substrate doping, guard ring depth, guard ring doping, oxide thickness, and oxide charge, under similar conditions. From the results of the simulation, we conclude that, in terms of leakage current, both structures behave similarly but in terms of breakdown voltage, n-in-p technology with p-spray shows better performances.
两种不同n-in-p硅粒子探测器结构的TCAD仿真比较研究
本文对两种不同的n-in-p硅粒子探测器结构进行了比较研究,以评估高亮度应用的候选未辐照器件的击穿电压。在高阻硅片上模拟了两种基于n-in-p技术的保护环之间有p喷隔离和没有p喷隔离的结构。在相似条件下,比较了两种结构在衬底厚度、衬底掺杂、保护环深度、保护环掺杂、氧化物厚度和氧化物电荷等参数下的模拟电特性。从模拟结果中,我们得出结论,在泄漏电流方面,两种结构的表现相似,但在击穿电压方面,具有p-spray的n-in-p技术表现出更好的性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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