The Lincoln programmable image-processing wafer

R. Berger, A. Bertapelli, R. Frankel, J.J. Hunt, J. Mann, J. Raffel, F. M. Rhodes, A. Soares, C. Woodward
{"title":"The Lincoln programmable image-processing wafer","authors":"R. Berger, A. Bertapelli, R. Frankel, J.J. Hunt, J. Mann, J. Raffel, F. M. Rhodes, A. Soares, C. Woodward","doi":"10.1109/ICWSI.1990.63878","DOIUrl":null,"url":null,"abstract":"The Programmable Image Processor is a laser-restructurable, wafer-scale device fabricated on a 125-mm wafer using an n-well CMOS process with 2.0 micrometer gates. Yield projections indicate that one wafer has enough devices to construct an array of 16 SIMD-programmable processors and 25 shared memories. The memory array can store two images each 128-by-128 pixels. One run of wafers has been fabricated, and these wafers were undergoing testing and restructuring at the time of publication.<<ETX>>","PeriodicalId":206140,"journal":{"name":"1990 Proceedings. International Conference on Wafer Scale Integration","volume":"25 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1990 Proceedings. International Conference on Wafer Scale Integration","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICWSI.1990.63878","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

Abstract

The Programmable Image Processor is a laser-restructurable, wafer-scale device fabricated on a 125-mm wafer using an n-well CMOS process with 2.0 micrometer gates. Yield projections indicate that one wafer has enough devices to construct an array of 16 SIMD-programmable processors and 25 shared memories. The memory array can store two images each 128-by-128 pixels. One run of wafers has been fabricated, and these wafers were undergoing testing and restructuring at the time of publication.<>
林肯可编程图像处理晶片
可编程图像处理器是一种激光可重构的晶圆级器件,采用带有2.0微米栅极的n阱CMOS工艺在125毫米晶圆上制造。产量预测表明,一个晶圆有足够的器件来构建一个由16个simd可编程处理器和25个共享存储器组成的阵列。存储器阵列可以存储两幅128 × 128像素的图像。一组晶圆已经制造完成,这些晶圆在本文发表时正在进行测试和重组
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